Home / Metal News / The Total Value of the Global Semiconductor Market Continues to Grow, While Spot Market Transactions Remain Sluggish [SMM Tin Morning News]

The Total Value of the Global Semiconductor Market Continues to Grow, While Spot Market Transactions Remain Sluggish [SMM Tin Morning News]

iconFeb 25, 2025 08:47
Source:SMM
Global Semiconductor Market Value Continues to Grow; Spot Market Transactions Remain Sluggish [SMM Tin Morning Brief] According to the report by WSTS (World Semiconductor Trade Statistics), the global semiconductor market value reached $170.9 billion in Q4 2024, up 17% YoY and up 3% QoQ. The annual market size was $628 billion, representing a 19.1% increase compared to 2023. Industry sources indicated that NVIDIA's next-generation Blackwell architecture GPU chips are in strong demand, with over 70% of TSMC's CoWoS-L advanced packaging capacity for this year already booked. Shipments are expected to grow by more than 20% per quarter. However, recent spot market transactions remain sluggish, as most downstream companies opt to consume existing inventory rather than actively procure. Due to high tin prices, market inquiry enthusiasm has weakened, and a general sentiment of caution prevails. Some downstream companies have made just-in-time procurement in small quantities during SHFE tin price corrections. Many traders reported that a significant number of clients' post-pricing orders for 250,000-yuan warehouse positions remain incomplete, currently in the stage of additional margin calls. If prices continue to rise, it may exert certain pressure on the cash flow of downstream companies.

SMM Tin Morning Brief on February 25, 2025: According to the report by WSTS (World Semiconductor Trade Statistics), the global semiconductor market value reached $170.9 billion in Q4 2024, up 17% YoY and up 3% QoQ. The annual market size was $628 billion, marking a 19.1% increase compared to 2023. Industry sources indicated that demand for NVIDIA's next-generation Blackwell architecture GPU chips remained strong, with over 70% of TSMC's CoWoS-L advanced packaging capacity for this year already booked. Shipments are expected to grow by more than 20% per quarter. However, recent spot market transactions have remained sluggish, as most downstream enterprises opted to consume existing inventory rather than actively procure. Due to high tin prices, market inquiry enthusiasm has weakened, and a wait-and-see sentiment prevails. Some downstream enterprises made small-scale just-in-time procurement during SHFE tin price corrections. Many traders reported that a significant number of 250,000-yuan warehouse-building post-pricing orders from customers remain incomplete, with additional margin calls currently in progress. If prices continue to rise, it may exert certain pressure on the cash flow of downstream enterprises.

For queries, please contact William Gu at williamgu@smm.cn

For more information on how to access our research reports, please email service.en@smm.cn

SMM Events & Webinars

All